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3–5 years in electronics or IoT product manufacturing, ideally with exposure to leadership responsibilities.
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Solid background in manufacturing engineering, with hands-on knowledge of PCB assembly and injection molding.
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Familiarity with RF systems, power electronics, wiring, and circuit testing/debugging.
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Minimum 2 years’ experience working on enclosure and PCB fabrication processes.
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Understanding of PCB design concepts, cost-efficient production, and new product introduction (NPI).
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Knowledge of supply chain practices for electronic components.
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Experience with wireless standards (Zigbee, Wi-Fi) and communication methods (IR, RF).
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Capable of using firmware tools to generate .Hex and .OTA files, with IR coding experience.
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Awareness of certification processes (UL, FCC) is advantageous.
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Tools like Wireshark, FirmwareTools, or Ubiqua are considered a plus.